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| A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules | |
Tian, Jun1; Wang, Congsi1; Liu, Shaoyi1; Zhu, Cheng1; Zhou, Cheng2; Liu, Jing2; Wang, Zhihai3; Yu, Kunpeng3; Wang, Lu3; Zheng, Yuanpeng4; Gao, Wei5; Shi, Yu6; Xu, Qian7
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| 2020-04-30 | |
| Conference Name | 20th International Conference on Electronic Packaging Technology, ICEPT 2019 |
| Source Publication | 2019 20th International Conference on Electronic Packaging Technology(ICEPT) |
| Pages | 9080946 |
| Conference Date | August 12, 2019 - August 15, 2019 |
| Conference Place | Hong Kong, China |
| Country | China |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Contribution Rank | 7 |
| Abstract | Microwave circuits and devices are widely used in the fields of communication, detection and chip components, etc. With the increasing demand of high speed, high reliability, miniaturization and integration of microwave electronic devices, the change of interconnection configuration in microwave components will have a significant impact on signal transmission performance. In this paper, a parametric representation model of flexible interconnection point configuration of gold belt in microwave module is established. Based on the parametric representation model, a coupling model is established to correlate the interconnection point configuration with signal transmission performance. This will provide theoretical guidance for engineers in interconnection design and transmission performance control, and ensure the design and service quality of high-performance electronic equipment. 2019 IEEE. |
| Keyword | Microwave circuits Belts Electronics packaging Flexible electronics Gold Integrated circuit interconnects Microwaves Timing circuits |
| DOI | 10.1109/ICEPT47577.2019.245165 |
| URL | 查看原文 |
| Indexed By | EI ; CPCI |
| Language | 英语 |
| ISBN | 978-1-7281-5065-9;978-1-7281-5064-2(eISBN) |
| WOS ID | WOS:000548058300018 |
| EI Accession Number | 20202108698972 |
| Citation statistics | |
| Document Type | 会议论文 |
| Identifier | http://ir.xao.ac.cn/handle/45760611-7/4172 |
| Collection | 射电天文研究室_天线技术实验室 |
| Affiliation | 1.Ministry of Education, Xidian University, Key Laboratory of Electronic Equipment Structure Design, Xi'an, China; 2.Xi'An Institute of Space Radio Technology, Xi'an, China; 3.CETC No.38 Research Institute, Hefei, China; 4.CETC No.54 Research Institute, Shijiazhuang, China; 5.University of New South Wales, School of Civil and Environmental Engineering, Sydney, Australia; 6.University of Chester, Department of Mechanical Engineering, Chester, United Kingdom; 7.China Academy of Sciences, XinJiang Astronomical Observatory, Urumqi, China |
| Recommended Citation GB/T 7714 | Tian, Jun,Wang, Congsi,Liu, Shaoyi,et al. A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules[C]:Institute of Electrical and Electronics Engineers Inc.,2020:9080946. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| Tian-2019-A Structur（3264KB） | 会议论文 | 开放获取 | CC BY-NC-SA | View Application Full Text | ||
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